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Antec Nano Diamond Thermal Compound Item # 880336
880336
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Description
Antec's Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 7's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on an overclocking environment, optimally performing between -50°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec's Formula 7 for a diamond-caliber solution.
Product Details
| Item # | 880336 |
| Manufacturer # | DY3379 |
| height | 3 in. |
| Additional Information | Diamond particles measuring 0.0000015 cm rated at 8.3 w/mK; Extended -50°C to 250°C stable temperature range ideal for performance cooling; Lighter, easier to spread stable composition won't crack or dry out |
| quantity | 1 |
| width | 1.1 in. |
| depth | 0.7 in. |
| Product Name | Nano Diamond Thermal Compound |
| manufacturer | Antec, Inc |
| weight | 0.14 oz |
| Thermal Conductivity | 8.3 W/mK |
| brand name | Antec |
| warranty length | 2-year limited |
| model name | Formula 7 |





